---
title: Heatsink
slug: one/mechanics/heatsink
docTags: 
createdAt: 2026-06-10T18:09:43.959Z
---

Inside Flipper One, several components generate a significant amount of heat. This heat cannot be trapped inside a plastic enclosure, otherwise some parts operating under sustained heavy load could reach high temperatures and gradually degrade over time.

The device also contains a Li-Ion battery, which should not be heated above 60 °C, as excessive heat accelerates battery degradation and negatively affects its lifespan and safety.

## Main heat sources

The main heat sources inside Flipper One are:

- **RK3576 SoC.** Up to **5.5 W** under maximum load (CPU + GPU + NPU simultaneously).
- **RK806S PMIC.** Up to around **2 W** at peak SoC load.
- **DDR5 RAM.** Up to **1.5 W** during memory-intensive operations.
- **BQ25792 charger.** Up to **1 W** while fast-charging the battery.

!["Location of the main heat-generating chips on the Flipper One PCB"](https://api.archbee.com/api/optimize/3StCFqarJkJQZV-7N79yY/E2u9mZTbDcsmOoqyiTfGY_flipper-one-hot-chips.png "Location of the main heat-generating chips on the Flipper One PCB")

In real-world use, reaching the maximum heat output is difficult. During heatsink testing, we use a synthetic workload designed to push the hardware to its thermal limits.

## Integrated aluminum heatsink

Flipper One dissipates heat from its hottest chips through a aluminum heatsink. In addition to thermal management, the heatsink also serves as a structural element, mechanically integrating with the enclosure and the main PCB.

!["Flipper One aluminum heatsink (HW rev. F0B0C1)"](https://api.archbee.com/api/optimize/3StCFqarJkJQZV-7N79yY/tvpBWau9V4P4Lp5TEV6ug_flipper-one-heatsink.png "Flipper One aluminum heatsink (HW rev. F0B0C1)")

Our preliminary simulations and real-world prototype testing at an ambient air temperature of 21 °C show that this heatsink can maintain the radiator temperature below 50 °C under realistic (non-synthetic) workloads with a thermal load of about 6 W.

At higher loads or higher ambient temperatures, the SoC will reduce CPU core frequencies, while the MCU will disable low-priority peripheral loads, limit charging power, and notify the user of these limits on the display.

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