Heatsink

inside flipper one, several components generate a significant amount of heat this heat cannot be trapped inside a plastic enclosure, otherwise some parts operating under sustained heavy load could reach high temperatures and gradually degrade over time the device also contains a li ion battery, which should not be heated above 60 °c, as excessive heat accelerates battery degradation and negatively affects its lifespan and safety main heat sources the main heat sources inside flipper one are rk3576 soc up to 5 5 w under maximum load (cpu + gpu + npu simultaneously) rk806s pmic up to around 2 w at peak soc load ddr5 ram up to 1 5 w during memory intensive operations bq25798 charger up to 1 w while fast charging the battery "location of the main heat generating chips on the flipper one pcb" in real world use, reaching the maximum heat output is difficult during heatsink testing, we use a synthetic workload designed to push the hardware to its thermal limits integrated aluminum heatsink flipper one dissipates heat from its hottest chips through a aluminum heatsink in addition to thermal management, the heatsink also serves as a structural element, mechanically integrating with the enclosure and the main pcb "flipper one aluminum heatsink (hw rev f0b0c1)" our preliminary simulations and real world prototype testing at an ambient air temperature of 21 °c show that this heatsink can maintain the radiator temperature below 50 °c under realistic (non synthetic) workloads with a thermal load of about 6 w at higher loads or higher ambient temperatures, the soc will reduce cpu core frequencies, while the mcu will disable low priority peripheral loads, limit charging power, and notify the user of these limits on the display